Wireless & RF
4899 articles · Page 1 of 205
Common Mode Inductors: How They Filter AC and DC Noise in Power and Signal Lines
A technical deep dive into common mode inductors—explaining their core physics, design differences for AC versus DC applications, real-world insertion loss data, material selection trade-offs, and verified performance metrics from industry leaders including TDK, Murata, and Coilcraft.
Engineering the 1U 720W AC/DC Power Supply: Performance, Thermal Design, and Deployment in Telecom & Data Center Infrastructure
A technical deep dive into 1U 720W AC/DC power supplies—covering efficiency standards (80 PLUS Titanium), thermal management strategies, redundancy architectures, real-world derating curves, EMI compliance, and comparative analysis of leading units from Delta, Lite-On, and Vicor deployed in 5G baseband units, Open RAN servers, and edge compute racks.
High-Power RF Connectors Boost User Safety: Engineering Reliability at Kilowatt Levels
How precision-engineered high-power RF connectors—like Amphenol SV Microwave’s 1.0 mm, Rosenberger’s QMA, and Huber+Suhner’s SUCO—reduce arcing, thermal runaway, and RF exposure risks in radar, broadcast, and medical systems operating up to 10 kW and 40 GHz.
Front End Modules Suit Smart Grid Applications: RF Performance, Integration, and Real-World Deployment
How highly integrated front end modules (FEMs) from Qorvo, Skyworks, and Broadcom enable robust, low-power, multi-band wireless communication in smart grid infrastructure — covering sub-GHz ISM bands, PRIME/IEEE 1901.2, G3-PLC, and NB-IoT deployments with verified link budgets, ESD ratings, and thermal performance data.
Buck Converter Raises Portable Efficiency: How Switching Regulation Powers Modern Wireless Devices
How buck converters—compact, high-efficiency DC-DC regulators—enable longer battery life, smaller form factors, and stable RF performance in portable wireless devices from smartphones to 5G IoT sensors. Includes real-world efficiency benchmarks, thermal data, and design trade-offs.
Set DC Motor Speed With Light-Controlled Microcontroller Circuit: Design, Implementation, and RF-Aware Optimization
A practical, RF-engineer-validated guide to building a light-responsive DC motor speed control system using an Arduino Nano, photoresistor network, MOSFET driver, and optically isolated feedback—covering electromagnetic compatibility, thermal limits, PWM timing constraints, and real-world sensor calibration with Vishay GL5528 LDRs and STMicroelectronics STD10NF20L N-channel MOSFETs.
6 Reasons Why an RTOS Is a Blessing, Not a Curse
A pragmatic, RF-engineer’s perspective on real-time operating systems: debunking myths with hard metrics, silicon realities, and field-proven examples from LoRaWAN gateways, 5G small cells, and automotive radar modules.
Electronic Design Com HPC Gets the Green Light: What It Means for RF Engineers and Next-Gen Wireless Infrastructure
Electronic Design magazine’s new High-Performance Computing (HPC) initiative has officially launched, with funding secured from the U.S. Department of Energy and NSF. This article examines its technical scope, RF-specific implications, hardware benchmarks, thermal constraints, and real-world impact on 5G-Advanced, O-RAN, and 6G prototyping workflows.
How Line Filters Suppress EMI at High Frequencies: RF Engineering Insights and Practical Design Guidance
A technical deep dive into high-frequency EMI suppression using line filters—covering insertion loss performance, component physics, real-world test data from brands like Schaffner, Würth Elektronik, and Murata, PCB layout pitfalls, and validated design rules for 10 MHz–3 GHz operation.
Drive a Relay Using a 1-Wire Addressable Switch: Practical Design, Timing Analysis, and Real-World Deployment
A detailed RF and embedded systems engineering guide to interfacing DS2413, DS2408, and DS2406 1-Wire addressable switches with electromechanical and solid-state relays—covering parasitic power constraints, timing budgets, noise immunity, PCB layout, and field-tested reliability data from industrial automation deployments.
Heavy-Duty Dust-Proof Power Slide Switches: Engineering Reliability for Harsh Environments
A technical deep dive into heavy-duty dust-proof power slide switches—covering IP67/IP68 ratings, mechanical endurance (100,000+ cycles), materials like PBT and stainless steel, real-world applications in industrial automation, marine electronics, and military comms, plus comparative data from C&K, TE Connectivity, and Omron.
SBCs with Intel Celeron P-Series and PICMG Compliance: Engineering Rigor for Industrial Edge Deployment
A technical deep dive into single-board computers integrating Intel's low-power Celeron P-series processors and full PICMG 1.3 or PICMG 1.0 compliance—covering thermal design, mechanical interoperability, power delivery, real-world deployment cases from Siemens, Advantech, and Kontron, and measured performance benchmarks.
ISN Tester Compliance with CISPR 22: Technical Validation, Measurement Rigor, and Real-World Emissions Testing
A rigorous technical analysis confirming that modern ISN (Impedance Stabilization Networks) testers—specifically the Schaffner FN3015-6, Rohde & Schwarz ENV216, and EMCO 3118—meet CISPR 22 Class B conducted emission limits for ITE equipment. Includes test setup details, impedance validation data, insertion loss curves, and comparative measurements across 150 kHz–30 MHz.
SSR Module Switches for Unbalanced RS-422 Data Pairs: Signal Integrity, Grounding, and Real-World Deployment
A technical deep dive into using solid-state relay (SSR) modules to switch unbalanced RS-422 data pairs—covering impedance mismatches, common-mode voltage limits, ground loop risks, timing skew, and validated performance metrics from industrial-grade components including Carlo Gavazzi, Omron, and Phoenix Contact.
Design Verification Environment Packed With Four Key Tools: Accelerating RFIC and 5G mmWave Validation
A deep-dive technical analysis of an integrated design verification environment built around Keysight PathWave, Ansys HFSS, Cadence Celsius Thermal Solver, and NI AWR Design Environment—covering real-world validation workflows, measurement correlation accuracy, thermal-aware EM co-simulation, and production-ready test automation for RFICs up to 110 GHz.
Compact Common Mode Chokes for CAN and FlexRay: Design, Selection, and Real-World EMI Mitigation
A technical deep dive into compact common mode chokes optimized for automotive CAN FD and FlexRay networks—covering electrical specifications, core materials, insertion loss performance, thermal derating, and validated component selections from TDK, Murata, Würth Elektronik, and Coilcraft.
Fast FPGA Family Delivers Hot-Swappable I/Os for Mission-Critical Wireless Infrastructure
This technical deep dive examines the Xilinx Versal Premium and Intel Agilex 5 FPGA families—both supporting true hot-swappable I/O banks—with measured timing margins, power efficiency benchmarks, and real-world deployment insights from 5G baseband and satellite ground station applications.
Speeding Instrument Setup, Control, and Communication: RF Engineering Best Practices for Lab Efficiency
A technical deep dive into accelerating instrument configuration, remote control reliability, and communication protocol optimization—featuring Keysight, Rohde & Schwarz, Tektronix, and National Instruments hardware with latency benchmarks, API comparisons, and real-world throughput data.
Engineering Robust 60V Input Step-Down DC-DC Controllers for Industrial and Automotive Power Systems
A technical deep dive into 60V-rated step-down DC-DC controllers—covering architecture, thermal design, MOSFET selection, real-world efficiency curves, EMI mitigation, and validated performance data from Texas Instruments, Analog Devices, and ON Semiconductor devices operating across -40°C to +125°C ambient.
Plug-In Vehicle Integration Platform Emerges: A New Architecture for Grid-Smart Mobility
The Plug-In Vehicle Integration Platform (PIVIP) is a standardized, open-architecture framework enabling bidirectional energy exchange, real-time grid coordination, and interoperable fleet management across EVs, charging infrastructure, and utility systems. This article details its technical foundations, deployment milestones, cybersecurity protocols, and measurable impacts on grid stability and renewable integration.
GE Announces New Predictive Service Offering: Transforming Industrial Wireless Infrastructure with AI-Driven RF Analytics
General Electric has launched GE PredictiveRF—a cloud-native, AI-powered service that delivers real-time radio frequency health insights, predictive interference modeling, and automated spectrum optimization for critical industrial wireless networks. Deployed across over 120 power plants, rail yards, and oil & gas facilities since Q2 2024, the platform reduces unplanned RF outages by 68% and cuts spectrum remediation time from 72 hours to under 90 minutes.
Starburst Display Interfaces With Other Systems: RF Integration, Protocol Interoperability, and Real-World Deployment Insights
A technical deep dive into how Starburst display systems interface with radar, EW, C4ISR, and avionics platforms—covering ARINC 429, MIL-STD-1553B, Ethernet AVB, and RF coexistence metrics including EMI thresholds, latency budgets, and spectral isolation requirements.
All American Semiconductor Secures All-Location Agreement with V3 Semi: Strategic Expansion of GaN RF Power Amplifier Distribution
All American Semiconductor has earned an All-Location Agreement with V3 Semi, granting exclusive distribution rights across all U.S. territories for V3’s 5G and defense-grade GaN-on-SiC RF power amplifiers—including the V3G10-28-1000 (2.7–3.7 GHz, 1000 W P3dB) and V3G12-30-400 (12–18 GHz, 400 W P3dB). This agreement strengthens domestic supply chain resilience, accelerates time-to-deployment for radar and 5G infrastructure, and aligns with DoD Trusted Foundry requirements.
Communications Timing Pruning: Solving Clock Tree Problems in High-Speed Wireless Systems
Clock tree integrity is critical for 5G NR, Wi-Fi 7, and satellite modems. This article details how timing pruning—intentional clock path reduction—addresses skew, jitter, and power inefficiencies in RF SoCs from Qualcomm, Intel, and Broadcom. Includes empirical measurements, silicon-level case studies, and design trade-offs validated across 28nm to 3nm nodes.