Sensors & Modules
5056 articles · Page 3 of 211
From Hephaestus Automatons to OpenAI’s Deep Learning: A 2,800-Year Evolution of Autonomous Systems
Tracing the lineage of automation from ancient Greek mythological constructs to modern AI-driven edge inference—this article examines material science, sensor fidelity, compute architecture, and real-world deployment constraints across millennia. Includes benchmark data for NVIDIA Jetson Orin NX (10 TOPS), Raspberry Pi 5 (3.9 GFLOPS), and LoRaWAN packet loss rates at 12 km.
Variable Gain Amplifiers: Design Principles, Real-World Integration, and Sensor Signal Chain Optimization
A technical deep dive into variable gain amplifiers (VGAs) for IoT and embedded systems—covering architecture types, noise performance, gain control interfaces, layout best practices, and real sensor integration case studies with Analog Devices, Texas Instruments, and Maxim Integrated components.
Silver-Filled Adhesive Shakes Off Oxidation: How Conductive Epoxy and Solder Alternatives Overcome Silver Sulfide Degradation in Harsh Environments
A technical deep dive into how silver-filled conductive adhesives—particularly those formulated with reactive stabilizers, particle-size optimization, and controlled resin chemistry—resist oxidation-induced resistance drift, contact failure, and interfacial delamination in industrial IoT sensors, automotive ECUs, and medical wearables operating at 85°C/85% RH or under H2S exposure.
Low-Cost DC-DC Converters That Fit Size-Sensitive Designs: Practical Selection Criteria and Real-World Tradeoffs
A detailed engineering analysis of compact, cost-effective DC-DC converters for space-constrained IoT and portable electronics—covering footprint, thermal performance, efficiency curves, and verified part numbers from Texas Instruments, Analog Devices, and MPS.
Infineon Technologies Signs Global Distribution Agreement with Avnet: Accelerating IoT Sensor Deployment Across Industrial and Automotive Markets
Infineon Technologies has formalized a strategic global distribution agreement with Avnet, effective Q2 2024. This partnership expands access to Infineon’s XENSIV™ sensor portfolio—including the DPS310 barometric pressure sensor (±0.02 hPa accuracy), TLI4971 current sensor (±0.5% total error over −40°C to +125°C), and REAL3™ time-of-flight imaging chips—across 38 countries. The move addresses critical supply chain bottlenecks for edge AI and battery-constrained IoT systems.
15 A Compact POL Converter Cuts Parts Count by 90%: How Integrated Power Delivery Is Reshaping IoT Hardware Design
A deep technical analysis of the TPS546D24A 15 A PMBus-enabled point-of-load converter—its architecture, thermal performance, BOM reduction impact, and real-world validation across industrial gateways, edge AI sensors, and battery-powered LoRaWAN nodes.
High Voltage Adjustable Shunt Regulator: Design Principles, Applications, and Real-World Implementation
A technical deep dive into high-voltage adjustable shunt regulators—including TL431A, REF5050, and LM4040 variants—covering electrical architecture, thermal management, layout best practices, and industrial use cases up to 36 V.
Encased VCO Sports: Engineering Precision in the 1 GHz to 2 GHz Bandwidth Range
A technical deep-dive into encased voltage-controlled oscillators (VCOs) operating from 1.0 GHz to 2.0 GHz — covering thermal stability, phase noise performance, package integration, and real-world validation across industrial, defense, and 5G test equipment applications.
Introduction to Control Algorithms in Switching Regulators
A technical deep dive into the core control algorithms—voltage-mode, current-mode, and advanced digital variants—used in modern switching regulators. Covers stability analysis, compensation design, real-world trade-offs, and implementation specifics from Texas Instruments, Analog Devices, and Infineon.
Addressing New Silicon Test Challenges With IEEE 1687 (IJTAG)
As SoCs scale beyond 50 billion transistors and integrate heterogeneous IP—including AI accelerators, high-speed SerDes, and embedded memories—traditional boundary-scan testing fails. This article examines how IEEE 1687 (IJTAG) delivers scalable, instrumented access to embedded instruments across complex silicon, with real-world data from AMD, Intel, and Arm-based designs.
Intelligent Power Switches: Engineering Precision for Fast Actuator Applications
How modern intelligent power switches—featuring sub-100 ns turn-on times, integrated diagnostics, and robust fault protection—enable reliable high-speed actuation in industrial automation, robotics, and EV battery management systems.
Platform Migration in IoT Systems: Engineering Realities, Risks, and Measured Outcomes
A technical deep dive into IoT platform migration—covering hardware compatibility constraints, firmware update strategies, sensor calibration drift, cloud API deprecation timelines, and quantified performance trade-offs across AWS IoT Core, Azure IoT Hub, and Google Cloud IoT Core migrations.
Plug-Top Power Supplies Are Energy Star Compliant: Efficiency, Certification, and Real-World Impact
A technical deep dive into Energy Star compliance for plug-top power supplies—covering test protocols, efficiency thresholds, brand-specific performance data, standby power limits, and measurable energy savings across global deployments.
LEDs for the Outdoors: Engineering Reliable, Efficient, and Weather-Resistant Lighting Solutions
A technical deep-dive into outdoor LED selection—covering IP ratings, thermal management, photometric performance, driver reliability, and real-world validation data from brands like Philips, Cree, Mean Well, and Bridgelux. Includes comparative tables, material specs, and field-tested deployment guidelines.
App Kit Trims Down Zigbee Budgets: How Modular Hardware Acceleration Cuts Development Costs by 37–52%
A deep technical analysis of how standardized Zigbee application kits—like Silicon Labs' ZDK-APPKIT-001 and NXP's JN5189-APPKIT—reduce BOM costs, shorten time-to-market, and eliminate redundant RF validation. Includes real-world cost breakdowns, power measurements, and interoperability test results across 14 certified devices.
PCI Express Switches: Architectural Trade-offs Between Large-Scale Data Center Fabrics and Compact Edge Devices
A technical deep dive into PCIe switch ICs—from 64-lane enterprise fabric controllers to sub-10mm² embedded switches—covering topology design, power budgets, signal integrity constraints, latency profiles, and real-world integration challenges across cloud infrastructure and IoT edge systems.
Advantech Launches Multi-Function USB I/O Module: A New Standard for Edge-Sensor Integration
Advantech’s new USB-5800 series redefines plug-and-play industrial I/O with simultaneous analog, digital, counter, and PWM capabilities — all in a compact, CE/FCC/UL-certified enclosure. Benchmarked against National Instruments USB-6009 and Keysight U2300A, it delivers 24-bit resolution, ±10 V input range, and <10 µs response latency.
SoC Linear Motion Encoder Delivers Sub-Micron Resolution for Precision Industrial Automation
Explore how modern System-on-Chip (SoC) linear motion encoders—such as the Renesas RA6T2-based LME-4000 series and Analog Devices AD7403-integrated encoders—achieve true 0.1 µm resolution, real-time 2 MHz sampling, and robust noise immunity in CNC machines, semiconductor lithography stages, and automated optical inspection systems.
I'm Connected to the Universe—but I Forgot My Password: The Hidden Fracture in IoT Identity Management
A technical examination of how consumer and industrial IoT devices—ranging from smart thermostats to satellite-ground stations—fail at secure, persistent identity management, leading to orphaned devices, cryptographic lockouts, and systemic resilience gaps.
A Solar Farm Grows in Brookhaven National Laboratory: Engineering Resilience, Research Integration, and Grid-Scale Renewables
Inside Brookhaven National Laboratory’s 3.5-megawatt solar photovoltaic array — a fully operational, research-integrated renewable energy installation featuring First Solar Series 6 thin-film modules, Siemens Sivacon switchgear, and real-time monitoring via Schneider Electric EcoStruxure. This article details hardware specifications, sensor architecture, grid interconnection, and how the facility serves as both power generator and living lab for next-generation energy systems.
Engineering High-Power DC-DC Converters: Design, Efficiency, and Real-World Deployment of 325W Output Modules
A technical deep dive into 325W DC-DC converter modules—covering thermal management, isolation standards, efficiency curves, EMI compliance, and validated performance data from Vicor, RECOM, and TDK-Lambda in industrial, automotive, and aerospace applications.
Optimizing Adapter Power Supply Design: Efficiency, Safety, and Regulatory Compliance for IoT Devices
A technical deep dive into designing high-efficiency, thermally robust, and globally certified AC/DC adapter power supplies for IoT edge devices—covering topology selection, thermal management, EMI mitigation, safety standards, and real-world validation metrics from leading manufacturers including Mean Well, Recom, and Texas Instruments.
Silicon Carbide MOSFETs Challenge IGBTs: Performance, Thermal Limits, and System-Level Tradeoffs in Modern Power Electronics
A technical deep-dive comparing SiC MOSFETs and silicon IGBTs across switching speed, conduction losses, thermal resistance, gate drive requirements, and real-world system performance—featuring data from Wolfspeed, Infineon, ON Semiconductor, and STMicroelectronics.
MCUs Enter Smart Objects and System Security Markets: From Peripherals to Trusted Execution Anchors
Microcontrollers are evolving beyond simple control tasks into foundational security enablers for smart objects—from industrial sensors to medical wearables. This article examines how ARM Cortex-M33, RISC-V PMP-enabled cores, and integrated cryptographic accelerators (like STM32U5’s AES-256-GCM and SHA-2) are redefining MCU roles in secure boot, attestation, and zero-trust edge architectures.