Sensors & Modules
5055 articles · Page 2 of 211
How a Full-Featured Industrial PC Fits Inside a Single CompactPCI Slot
Exploring the engineering breakthroughs that enable complete x86 computing systems—including dual-core CPUs, 16 GB DDR4 RAM, PCIe Gen3 I/O, and SATA storage—to operate within the strict mechanical and thermal constraints of a single 3U CompactPCI (cPCI) slot.
Sierra Wireless Expands Global Reach With Acquisition of UK-Based CP Engineering
Sierra Wireless’ strategic acquisition of CP Engineering—a UK-based IoT hardware design and certification specialist—marks a pivotal expansion in its global engineering footprint, accelerating time-to-market for cellular IoT solutions across EMEA, APAC, and North America.
Your Customers Can’t Roam If IS-41 Isn’t Verified: Why SS7 Interoperability Is Non-Negotiable for Global IoT Connectivity
A deep technical analysis of IS-41 protocol verification in mobile network infrastructure—explaining how unverified IS-41 implementations cripple international roaming for IoT devices, with real-world failure cases from Vodafone, AT&T, and Deutsche Telekom deployments.
Press-In Connectors: Enabling Flexible, High-Reliability Backplane Assembly Across Industrial and Telecom Systems
How press-in (press-fit) connectors eliminate soldering in backplane assembly—reducing thermal stress, improving yield, and enabling mixed-component integration with precision tolerances, proven reliability, and field-proven performance from TE Connectivity, Samtec, and Amphenol.
App Board Abets Remote Control Designs: Accelerating Development with Integrated Hardware-Software Platforms
How modern application boards like the ESP32-WROVER, Nordic nRF52840 DK, and Raspberry Pi Pico W streamline remote control hardware development—covering RF protocols, power optimization, sensor fusion, certification pathways, and real-world latency benchmarks.
Researchers Use UV Light to Control the Size of Nanopores: A Breakthrough in Dynamic Nanofluidic Engineering
A groundbreaking study demonstrates reversible, sub-5-nm nanopore resizing using UV-triggered photochemical crosslinking in graphene oxide membranes. This article details the materials science, optical parameters, real-world validation data, and implications for next-generation biosensing and water desalination.
Devices Go Beyond Digital Zone To Digital Home: The Convergence of Sensing, Connectivity, and Context-Aware Intelligence
How modern IoT hardware—powered by multi-modal sensors, edge AI, and interoperable protocols—is transforming isolated smart devices into a unified, adaptive, and human-centered digital home ecosystem.
Cylinder Mounting System Secures From Inside Out: Engineering Precision for Industrial Pneumatics and IoT Integration
A deep technical analysis of modern cylinder mounting systems that prioritize internal structural integrity, load-path optimization, and sensor-ready integration—featuring Parker Hannifin, Festo, SMC, and Bosch Rexroth solutions with dimensional tolerances, torque specs, and real-world IoT deployment data.
Digitally Programmable Electronic Loads with Serial Input: Precision Power Sinking for Modern Test Systems
A technical deep dive into serially controlled electronic loads—covering RS-232, USB-VCOM, and LAN interfaces—featuring real-world specifications from Keysight, Chroma, BK Precision, and Rigol. Includes protocol analysis, timing benchmarks, and integration best practices for automated power electronics validation.
Touch Screens Aid Automated Operations: Engineering Real-World Efficiency in Industrial, Medical, and Logistics Systems
How modern resistive, capacitive, and surface acoustic wave touch technologies integrate with PLCs, RTOS-based controllers, and edge AI to reduce human intervention, cut cycle times by up to 37%, and improve HMI reliability across factory floors, hospital labs, and automated warehouses.
The Engineer's Assistant: A Practical Toolkit for IoT Hardware Development and Sensor Integration
A field-tested reference for embedded systems engineers building reliable, production-ready IoT devices — covering sensor selection criteria, signal conditioning pitfalls, PCB layout best practices, firmware architecture patterns, and real-world validation metrics from deployments using Bosch BME680, Analog Devices AD7793, and Texas Instruments CC2652R.
How High-Power Resistors Safeguard Motors: Engineering Principles, Real-World Applications, and Design Best Practices
A technical deep dive into the critical role of high-power resistors in motor protection—covering inrush current limiting, dynamic braking, snubbing, thermal management, and component selection with real-world data from Vishay, Ohmite, Caddock, and Bourns.
JTAG-PCI Test Module: Enabling Boundary-Scan Diagnostics for PCIe Card Validation
A deep technical analysis of the JTAG-PCI Test Module—a hardware interface enabling IEEE 1149.1 boundary-scan testing of PCI Express add-in cards during design validation, manufacturing test, and field diagnostics. Covers architecture, signal integrity requirements, integration workflows, and real-world case studies from NVIDIA, AMD, and Intel reference designs.
PCB Keylock Switches Go Mini and Sub-Mini: Engineering Evolution for Space-Constrained IoT and Industrial Systems
A technical deep dive into the miniaturization of PCB-mounted keylock switches—covering mechanical design, electrical specs, mounting standards, real-world applications, and comparative analysis of leading brands including C&K, Omron, TE Connectivity, and Alps Alpine.
Regulated Charge Pump Converters Eliminate Need For Inductors: A Practical Engineering Perspective
How modern regulated charge pump DC-DC converters—like those from Texas Instruments, Analog Devices, and Maxim Integrated—deliver precise voltage regulation without inductors, enabling ultra-small, EMI-clean, and cost-optimized power solutions for IoT sensors, wearables, and edge AI nodes.
MEMS May Lead To Chip-Based Personal Electron Accelerator: Engineering the Next Frontier in Compact Particle Acceleration
This article explores how microelectromechanical systems (MEMS) technology is enabling the development of chip-scale electron accelerators—devices that shrink tabletop accelerators into silicon chips. We analyze breakthroughs from Stanford, UCLA, and IMEC; examine RF cavity miniaturization, dielectric laser acceleration (DLA), and integrated beam control; and assess power efficiency, beam quality, and near-term applications in portable X-ray sources, radiation therapy, and lab-on-a-chip diagnostics.
Tiny MOSFETs Can Handle The Heat: Thermal Performance, Packaging Innovations, and Real-World Power Management
How ultra-compact MOSFETs—from 1.0 mm × 0.6 mm WLCSP to 2.0 mm × 2.0 mm PQFN—deliver robust thermal performance in space-constrained IoT edge devices, backed by measured junction-to-ambient resistance (RθJA), transient thermal impedance curves, and field data from industrial gateways and battery-powered sensors.
Molded SMD Power Inductors: Engineering, Performance, and Real-World Integration in Modern Power Electronics
A technical deep dive into molded SMD power inductors—covering construction, magnetic core materials, thermal behavior, DC bias saturation curves, EMI suppression, and comparative performance data from industry leaders including TDK, Vishay, Coilcraft, and Würth Elektronik.
A Guide To Wireless Connectors: Standards, Performance Metrics, and Real-World Integration for IoT Engineers
A technical deep dive into wireless connectors used in industrial IoT, covering RF interface standards (U.FL, IPEX, MHF), impedance matching, insertion loss, VSWR, environmental ratings, and integration best practices—with measured data from Amphenol, Hirose, TE Connectivity, and Molex.
How the TPS7A88-Q1 Low-Dropout Regulator Delivers Stable 15 A Peak Current with <100 mV Dropout at Full Load
A deep technical analysis of Texas Instruments' TPS7A88-Q1 automotive-grade LDO—its architecture, thermal management, transient response, and real-world validation in ADAS camera modules and radar processors.
Discussion Panel Focuses On Fuel Cells For Telecom: Real-World Deployment, Reliability Metrics, and Grid-Independent Power Strategies
A technical deep-dive into the 2024 GSMA Mobile World Congress panel on fuel cell adoption in telecom infrastructure—covering PEM and SOFC deployments across India, Nigeria, and Brazil; runtime validation data from Nokia, Ericsson, and Huawei sites; hydrogen logistics challenges; and comparative LCOE analysis versus diesel generators and lithium-ion UPS systems.
Texas Instruments EV Charging Station Innovations Boost Efficiency and Speed
Texas Instruments is accelerating the global transition to electric mobility with semiconductor innovations that improve power density, thermal management, and control precision in EV charging infrastructure — from 3.3 kW AC wallboxes to 350 kW ultra-fast DC chargers.
How Modern Interface ICs Simplify Multi-Sensor Integration in Industrial and Embedded Systems
Interface ICs like the Texas Instruments ADS131M08, Analog Devices AD7798, and STMicroelectronics LIS2DW12 enable robust, scalable sensor aggregation with built-in synchronization, configurable I/O, and hardware-level fault detection—reducing BOM count by up to 40% and cutting PCB area by 35% compared to discrete solutions.
Electronic Design Com HPC: Reaching a Higher Performance Standard
How high-performance computing is reshaping electronic design workflows—driving innovations in thermal management, signal integrity, power delivery, and heterogeneous integration with real-world case studies from NVIDIA, AMD, Intel, and Arm-based platforms.