Passive Components
5055 articles · Page 3 of 211
FPGA Design Suite Supports Graphical Block-Based Design Entry: Efficiency, Accuracy, and Real-World Implementation
A technical deep dive into how modern FPGA design suites—including Xilinx Vivado, Intel Quartus Prime, and Lattice Diamond—leverage graphical block-based design entry to accelerate development, reduce errors, and improve collaboration across hardware and firmware teams.
800W Switchers Are Only 26 mm High: Why Ultra-Low Profile Power Supplies Are Reshaping Industrial and Telecom Design
An in-depth engineering analysis of modern 800W AC-DC switch-mode power supplies with 26 mm height—covering thermal architecture, magnetics optimization, PCB stacking, regulatory compliance, and real-world trade-offs using data from TDK-Lambda, Cosel, XP Power, and Delta Electronics.
Switch Fabric Technology Enables On-Chip Networks: Architecture, Scaling, and Real-World Implementation
How modern switch fabrics—built with silicon photonics, advanced SerDes, and mesh/ring topologies—power high-bandwidth, low-latency on-chip networks in AI accelerators, multi-die CPUs, and HPC SoCs. Includes die area, latency, power, and bandwidth data from AMD, Intel, NVIDIA, and TSMC.
Tegam Amplifier Stretches PXI Measurement Range: Extending Precision Beyond Native Limits
How the Tegam 1750A Precision DC Voltage Amplifier enables PXI systems to measure signals as low as ±20 nV and as high as ±10 V with 0.5 ppm linearity—unlocking new capabilities in metrology-grade test setups.
Tiny SSR Can Switch 2A at 250 VAC: Real-World Performance, Thermal Limits, and Design Tradeoffs
A detailed engineering analysis of miniature solid-state relays rated for 2 A at 250 VAC — covering thermal derating, zero-crossing behavior, creepage/clearance compliance, and comparative data from Omron, Panasonic, and Vishay devices.
MTS-209 Selected to Support Thailand’s T-50TH Trainer Aircraft: Precision Passive Integration for Advanced Flight Training
The MTS-209 high-reliability passive component module from Murata Manufacturing Co., Ltd. has been selected by the Royal Thai Air Force (RTAF) and its prime contractor, Korean Aerospace Industries (KAI), for integration into the T-50TH advanced jet trainer fleet. This article details the technical rationale, environmental qualification, signal integrity performance, and supply chain advantages driving this selection.
DSP Emulator Achieves Bidirectional Data Streaming at Video Speeds
A breakthrough in real-time signal processing: the ADSP-SC589-based emulator delivers sustained 2.4 Gbps bidirectional throughput with sub-1.2 µs latency—enabling frame-accurate HDMI 2.0 and MIPI CSI-2 co-simulation for embedded vision systems.
Communications Wireless Chip Sets Comply With IEEE 802.11n and Deliver 300 Mbps Throughput: Engineering Analysis and Component Selection Criteria
A technical deep dive into IEEE 802.11n-compliant wireless chip sets delivering 300 Mbps PHY data rates, covering RF architecture, passive component requirements, real-world performance validation, and design trade-offs for embedded communications systems.
Kontron Delivers Industry’s Lightest HMI Products: Engineering Breakthroughs in Industrial Human-Machine Interface Design
Kontron’s latest generation of ultra-lightweight HMIs—featuring the KBOX-2000 series (starting at 395 g) and KPanel-1500 series (as low as 780 g)—redefines weight, thermal efficiency, and ruggedness for industrial automation. This article details material science innovations, mechanical design trade-offs, EMI mitigation strategies, and real-world deployment metrics across automotive, rail, and medical OEM applications.
Design FAQ: Managing Embedded Storage Using ECC-Enabled Flash Memory
A practical engineering guide to selecting, configuring, and validating ECC-enabled NAND and NOR flash for mission-critical embedded systems — covering bit error rates, correction strength, layout trade-offs, vendor-specific implementations (Micron, Samsung, Winbond), and real-world failure mode mitigation.
Compact 45W Single-Output DIN Rail Power Supply with Integrated EMI Filter: Engineering Insights and Real-World Deployment
A technical deep dive into compact 45W DIN rail power supplies featuring built-in EMI filters—covering regulatory compliance, thermal design, filter topology, efficiency benchmarks, and comparative analysis of leading models from Mean Well, TDK-Lambda, and Phoenix Contact.
11 Myths About SOSA OpenVPX Chassis Platforms — Debunked by a Circuit Design Engineer
A circuit design engineer debunks 11 persistent myths about SOSA-compliant OpenVPX chassis platforms—covering thermal management, power delivery, interoperability, scalability, and real-world deployment constraints—with verified data from Curtiss-Wright, Mercury Systems, and GE Aerospace systems.
Green Patent Applications Promised a Speedy Review: Accelerating Innovation in Sustainable Electronics
How the USPTO’s Green Patent Pilot Program and subsequent Track One prioritization reshaped patent timelines for energy-efficient circuits, low-loss magnetics, and eco-conscious passive component designs — with real-world data, component benchmarks, and strategic filing insights.
Self-Faced Foam Absorbs Unwanted Noise: Engineering Performance Through Integrated Surface Integrity
A technical deep dive into self-faced acoustic foam—its material science, performance metrics, real-world applications, and comparative advantages over traditional open-cell foams. Includes measured NRC, STC, and impedance data from leading manufacturers including AcoustiFelt, ATS Acoustics, and Kustom Felt.
Test Equipment Must Keep Pace With New High-Power Semiconductor Developments
As silicon carbide (SiC) and gallium nitride (GaN) devices push switching frequencies beyond 2 MHz, handle 3.3 kV blocking voltages, and operate at junction temperatures above 200°C, legacy test instrumentation fails to capture critical dynamic behavior—leading to design over-margining, thermal runaway risks, and field failures.
FRAM MCUs in Motorsport Data Acquisition: Race-Grade Reliability, Real-Time Power Efficiency, and Raze-Optimized Firmware
A technical deep dive into ferroelectric RAM-based microcontrollers for high-fidelity race data logging—covering endurance under 100g shock, sub-50ns write latency, power consumption below 120 µA/MHz, and firmware architectures validated on Formula E Gen3 powertrains and WEC LMDh prototypes.
Solid-State Relay Pair Sets: On-Resistance Standardization, Measurement Practices, and Design Implications
A technical deep dive into the on-resistance specifications of solid-state relay (SSR) pair sets—dual-channel, complementary, or matched SSR configurations—covering industry measurement standards, test conditions, real-world data from leading manufacturers, thermal derating effects, and design-critical implications for precision analog switching, battery management, and high-fidelity signal routing.
How Small-Power Amplifiers Cut Component Cost Without Sacrificing Performance
Engineers are increasingly adopting small-power amplifiers (≤1 W RF output) to reduce BOM cost, simplify thermal management, and shrink PCB area—while maintaining signal integrity in IoT, wearables, and industrial sensor nodes. This article details real-world cost savings using Murata, Qorvo, and Skyworks devices, quantifies passive component reductions, and presents validated design trade-offs.
Serializer-Deserializer ICs in Fiber Optic Systems: Performance, Selection Criteria, and Real-World Deployment Insights
A technical deep-dive into SerDes ICs for fiber-optic communication—covering data rates up to 112 Gbps PAM4, jitter budgets under 0.3 UI, power efficiency metrics (e.g., 4.2 pJ/bit for Marvell Alaska C), compliance with IEEE 802.3ck and ITU-T G.709.2, and design tradeoffs across datacenter, telecom, and coherent transmission applications.
SMT Crystals Have Wide Frequency Range: Engineering Reality, Not Marketing Hype
SMT crystals span 1 kHz to 260 MHz with precision and reliability—backed by real-world data from Murata, TXC, NDK, and Abracon. This article details frequency coverage, stability trade-offs, package constraints, and application-specific selection criteria.
How a 480 kWh Battery Storage System Slashed Demand Charges by 72% for Oakwood Senior Living — Saving $90,000 Annually
Oakwood Senior Living, a 220-unit retirement community in Tempe, Arizona, reduced its peak demand from 312 kW to 87 kW using a Fluence Cube 480 battery system and advanced load-shifting controls—cutting annual demand charges by $89,760 under APS’s Commercial Time-of-Use Rate 23. This article details the engineering rationale, component selection, tariff analysis, and verified financial impact.
What’s All This 3D Scanning Stuff Anyhow?
A practical, component-focused engineer’s guide to 3D scanning technologies—covering principles, hardware trade-offs, metrology-grade accuracy benchmarks, real-world PCB and enclosure use cases, and how passive component selection impacts scanner performance and reliability.
All Wireless Cellular Devices Must Be Secured: A Circuit-Level Imperative for Modern Connectivity
Why securing wireless cellular devices isn't optional—it's a foundational requirement rooted in RF physics, regulatory mandates, and real-world attack vectors. This article details hardware-level vulnerabilities, validated mitigation strategies, and component selection criteria for engineers building LTE-M, NB-IoT, and 5G NR devices.
Industry Competitors Cooperate to Advance CMOS: How Rival Chipmakers, Foundries, and IP Providers Are Uniting to Extend Moore’s Law
A deep technical analysis of unprecedented cross-competitive collaboration in the CMOS ecosystem—covering joint node development, shared PDKs, standardized interface IP, and co-funded R&D initiatives among Intel, TSMC, Samsung, Arm, Synopsys, and GlobalFoundries.